Startup Looks to Put PAs on CMOS Express
Dylan McGrath, EETimes
7/8/2016 05:01 PM EDT
SAN FRANCISCO—After emerging from semi-stealth mode to announce the infusion of $35 million in April, ACCO Semiconductor Inc. is looking to take its CMOS-based RF power amplifier business to the next level.
The Sunnyvale, Calif.-based startup, which traces its roots back to 1994, believes it can cash in on the growing opportunity for RF front end chips for cell phones and Internet of Things (IoT) products by strapping power amplifiers (PAs) to the same economic engine that has propelled most other types of chips: complementary metal–oxide–semiconductor (CMOS) process technology.
PAs are required for communications in modern cell phones and many IoT-connected products. The vast majority are built using silicon germanium or gallium arsenide technology rather than CMOS. ACCO has since 2007 been developing a technology to enable PAs to be built using CMOS, which the firm believes will enable them to take advantage of CMOS integration, Moore’s Law and the growing market for smartphones and IoT devices.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Startup looks to put price tags on IP cores
- Rambus PCI Express PHY IP on Fujitsu 90nm CMOS Process
- LEDA Systems®'PCI Express I/O Library Targets UMC's 0.13-micron advanced CMOS process
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity