World’s smallest Bluetooth radio now portable
Ericsson Technology Licensing announced today the availability of a new Bluetooth solution for semiconductor and OEM companies. The solution consists of complete package for process porting of its 4th generation, fully integrated Bluetooth front-end radio.
Sep 27, 2002 - The new license package, called K-D1, is intended to provide Semiconductor companies and Integrating OEM's with a competitive, Bluetooth radio core, thereby enhancing time-to-market.
What makes the K-D1 package so unique is its completely portable design, enabling customers to differentiate their products not only for various manufacturing processes, but also for different market segments. The package includes evaluation hardware and design database, as well as simulation results and schematics. Furthermore, qualified samples manufactured in the foundry mother process are also included. This has been proven to accelerate the process of porting and to minimize engineering efforts.
"We are proud to offer our customers the fruits of our many years of Bluetooth radio development coupled with our vast working experience within various process technologies," says Maria Khorsand, President of Ericsson Technology Licensing.
The product design behind K-D1 belongs to the 4th generation family of Bluetooth radio designs from Ericsson. Using only 6 mm2 of silicon, it is currently the only complete, on-chip integration of the radio front-end, effectively eliminating the considerable production steps associated with module design and manufacturing.
"Whereas two-chip and single-chip modules have played important roles in the early Bluetooth market, the increasing demand for module-free solutions represents a natural step in the evolution towards reduced cost and footprint requirements," says Maria Khorsand.
About Ericsson Technology Licensing
Ericsson Technology Licensing provides Bluetooth design solutions tailored for the mass market to many of the world's largest manufacturers. No company has been working longer or harder with Bluetooth wireless technology than Ericsson. We began our research back in 1994. Ericsson helped found the Bluetooth Special Interest Group (SIG) and was the first company to put Bluetooth consumer products into mass production.
Ericsson is shaping the future of Mobile and Broadband Internet communication through its continuous technology leadership. Providing innovative solutions in more than 140 countries, Ericsson is helping to create the most powerful communication in the world.
The BLUETOOTH trademarks are owned by their proprietor and used by Ericsson under license.
|
Related News
- CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
- GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio
- Gear Radio Introduces Complete Bluetooth 5 Low-Power IP Solution for IoT SoC Applications
- UMC and Gear Radio Introduce 55nm Bluetooth 5 IP Platform
- 聯華電子和聚睿電子共同合作開發55奈米藍牙5 IP平台
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |