Samsung to License Patent Portfolio From Tela Innovations
LOS GATOS, Calif. – August 8, 2016 – Tela Innovations, Inc. announced that Samsung Electronics Co, Ltd. has entered into an agreement to license Tela’s extensive portfolio of semiconductor related patents. Samsung, a global leader in semiconductor design and manufacturing, joins Qualcomm, Google and TSMC as licensees of Tela’s innovative solutions for scaling complex chip designs to more advanced manufacturing nodes. Terms of the deal are confidential.
Tela has developed technology that addresses the physical design constraints imposed by lithography limitations at geometries of 28nm and smaller. Its extensive patent portfolio is available for licensing to semiconductor and electronics companies to address design challenges at advanced technology nodes. A description of Tela’s patent portfolio as well as a listing of all of Tela’s U.S. patents can be found on Tela’s website.
About Tela
Tela Innovations is a privately-held company based in Los Gatos, California that provides solutions addressing the challenge of scaling semiconductor design and manufacturing to advanced process nodes. Tela was founded in 2005 by a team of experts in semiconductor IP, design automation and process technology, and is backed by a number of venture firms and corporate investors. For more information on the company visit www.tela-inc.com.
|
Related News
- MPEG LA Offers One-Stop License for ATSC 3.0
- Hisense Enters Into MPEG LA's AVC Patent Portfolio License
- Huawei Enters into MPEG LA's AVC Patent Portfolio License
- Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
- MPEG LA Releases MPEG-DASH Patent Portfolio License
Breaking News
- Intel brings 3nm production to Europe in 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |