Samsung to License Patent Portfolio From Tela Innovations
LOS GATOS, Calif. – August 8, 2016 – Tela Innovations, Inc. announced that Samsung Electronics Co, Ltd. has entered into an agreement to license Tela’s extensive portfolio of semiconductor related patents. Samsung, a global leader in semiconductor design and manufacturing, joins Qualcomm, Google and TSMC as licensees of Tela’s innovative solutions for scaling complex chip designs to more advanced manufacturing nodes. Terms of the deal are confidential.
Tela has developed technology that addresses the physical design constraints imposed by lithography limitations at geometries of 28nm and smaller. Its extensive patent portfolio is available for licensing to semiconductor and electronics companies to address design challenges at advanced technology nodes. A description of Tela’s patent portfolio as well as a listing of all of Tela’s U.S. patents can be found on Tela’s website.
About Tela
Tela Innovations is a privately-held company based in Los Gatos, California that provides solutions addressing the challenge of scaling semiconductor design and manufacturing to advanced process nodes. Tela was founded in 2005 by a team of experts in semiconductor IP, design automation and process technology, and is backed by a number of venture firms and corporate investors. For more information on the company visit www.tela-inc.com.
|
Related News
- MPEG LA Offers One-Stop License for ATSC 3.0
- Hisense Enters Into MPEG LA's AVC Patent Portfolio License
- Huawei Enters into MPEG LA's AVC Patent Portfolio License
- Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
- MPEG LA Releases MPEG-DASH Patent Portfolio License
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |