GUC President Jim Lai Announces Retirement
August 10, 2016 - Hsinchu, Taiwan -- Jim Lai, President of Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, announced his retirement during a Board of Directors meeting on August 4. He cited personal reasons for his decision.
Mr. Lai was named President of GUC in 2003 and firmly established the company's focus on technology and its customer-first strategy. He was actively involved in expanding the business and in improving operational efficiency. Mr. Lai guided GUC’s successful IPO in November of 2006 and led the company's rise to becoming the global semiconductor design service leader in terms of revenue. His outstanding achievements have received wide acclaim.
The GUC Board of Directors expressed their appreciation for Mr. Lai's contributions and wished him well in his future endeavors. At the same time, they appointed Dr. Ken Chen as President to succeed Mr. Lai. Dr. Chen will officially begin his responsibilities on September 1.
With nearly 24 years of semiconductor industry experience, Dr. Ken Chen is eminently qualified to lead GUC. He assumes his new position after serving as Senior Director of Business Development at Taiwan Semiconductor Manufacturing Company (TSMC), where he also held a variety of management positions at TSMC North America and TSMC Japan. Prior to joining, TSMC, Dr. Chen worked at Intel and after earning his PhD in Materials Science & Engineering from Stanford University.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsinchu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
|
Related News
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |