OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2016 OIP Ecosystem Forum
SAN JOSE, Calif. -- Sept. 12, 2016 -- OmniPHY Semiconductor, Inc. today announced it will be showcasing how it leverages TSMC manufacturing technology to create robust automotive semiconductor IP solutions at the TSMC 2016 OIP Ecosystem Forum. The event is being held on September 22, 2016, at the Santa Clara Convention Center.
What:
OmniPHY will be showcasing it’s IP solutions in booth 501, including:
Autmotive Ethernet IP and Connectivity Solutions: Automotive Ethernet is a new standard that will be the backbone of the in-car network powering vehicles to become autonomous ‘Servers with Wheels.’ The first designs support 100Mb communication over a single pair of unshielded twisted pair. Come see a live demonstration of this exciting new technology. Engineers will be onhand to describe how we create IP for the Automotive market.
Industrial Ethernet: OmniPHY has developed a unique multiprotocol Ethernet PHY design that features deterministic (and low) latency, the most advanced diagnostics, and support for extended temperatures handling rugged conditionsvibrations. Customers are introducing this IP into their own industrial SOC’s and enabling the Industrial IoT.
Enabling the Cloud: Compelling SerDes designs for the enterprise market with support for 100G Ethernet backplane/twinax cable, and the 28G Common Electrical Interface (CEI) standards satisfying the growing bandwidth needs for the Cloud Datacenters
Connected Home: A novel solution for USB TypeC connectivity, and several other solutions including 10/100 Ethernet, PCI Express, SATA, and DDR. OmniPHY is powering the convergence of home networking and entertainment.
In addition, experts from our design and applications teams will be on hand to answer questions and engage in technical dialog.
When:
TSMC's OIP Forum is on September 22, 2016.
Where:
Santa Clara Convention Center
Booth 501
About OmniPHY
OmniPHY is a leading provider of highly specialized interface IP and communication technology, offering customers greater design margins and fast time-to-market for emerging standards, including 1.25-28 GB/s PHY designs and 10/100/1000BASE-T Ethernet in advanced processes. The company serves the Automotive, Industrial, Consumer, and Enterprise segments through it’s lineup of silicon-proven PHY IP.
For more info: http://www.omniphysemi.com/
|
Related News
- OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2017 OIP Ecosystem Forum
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
- Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate New High Performance and Ultra-Low Power SERDES IP at TSMC Open Innovation Platform Ecosystem Forum
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |