North American Semiconductor Equipment Industry Posts August 2016 Book-to-Bill Ratio of 1.03
SAN JOSE, Calif. — September 15, 2016 — North America-based manufacturers of semiconductor equipment posted $1.75 billion in orders worldwide in August 2016 (three-month average basis) and a book-to-bill ratio of 1.03, according to the August Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI. A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.
SEMI reports that the three-month average of worldwide bookings in August 2016 was $1.75 billion. The bookings figure is 2.3 percent lower than the final July 2016 level of $1.80 billion, and is 5.0 percent higher than the August 2015 order level of $1.67 billion.
The three-month average of worldwide billings in August 2016 was $1.71 billion. The billings figure is approximately the same as the final July 2016 level of $1.71 billion, and is 8.4 percent higher than the August 2015 billings level of $1.58 billion.
"The book-to-bill ratio has been at or above parity since December of last year with current monthly bookings and billings levels at $1.7 billion,” said Denny McGuirk, president and CEO of SEMI. “Given the current data trends, North American equipment suppliers are clearly benefiting from strong investments by device manufacturers in the second half of the year.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
| Billings | Bookings | Book-to-Bill |
March 2016 | $1,197.6 | $1,379.2 | 1.15 |
April 2016 | $1,460.2 | $1,595.4 | 1.09 |
May 2016 | $1,601.5 | $1,750.5 | 1.09 |
June 2016 | $1,715.2 | $1,714.3 | 1.00 |
July 2016 (final) | $1,707.9 | $1,795.4 | 1.05 |
August 2016 (prelim) | $1,708.1 | $1,753.9 | 1.03 |
Source: SEMI (www.semi.org), September 2016
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the SEMI Equipment Market Data Subscription (EMDS).
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information about SEMI, visit www.semi.org.
|
Related News
- North American Semiconductor Equipment Industry Posts January 2015 Book-to-Bill Ratio of 1.03
- North American Semiconductor Equipment Industry Posts October 2016 Book-to-Bill Ratio of 0.91
- North American Semiconductor Equipment Industry Posts September 2016 Book-to-Bill Ratio of 1.05
- North American Semiconductor Equipment Industry Posts July 2016 Book-to-Bill Ratio of 1.05
- North American Semiconductor Equipment Industry Posts May 2016 Book-to-Bill Ratio of 1.09
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |