Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process
IP Solutions address requirements for automotive ADAS and infotainment applications
SAN JOSE, Calif. -- 20 Sep 2016 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced a broad portfolio of Cadence® interface and Denali® memory IP solutions for automotive applications supporting TSMC’s 16nm FinFET Compact (16FFC) process. By offering a wide array of IP using TSMC’s 16FFC process, Cadence is enabling automotive customers to accelerate time to market while gaining the benefits of TSMC’s most advanced process technology used in automotive applications.
For more information on Cadence’s IP offerings, visit: www.cadence.com/go/tsmc-16ffc-ip.
These newly announced automotive IP solutions are designed for high reliability and support the most common interfaces used in automotive advanced driver assistance system (ADAS) technology and are helping to deliver innovation for infotainment applications. The interface designs include support for DDR/LPDDR, PCI Express® (PCIe®), MIPI®, automotive Ethernet and USB. In addition, Cadence anticipates initial customer deliveries of the first high-speed SerDes and low-latency DDR IP for use with TSMC’s 16FFC process in the fourth quarter of this year.
“TSMC is working closely with Cadence to enable the necessary design IP for our mutual customers building advanced automotive electronic systems, including functions such as ADAS, infotainment, high-fidelity audio and in-car networking,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division.
“Cadence is making a significant long-term investment in the automotive market segment. Working closely with TSMC, we are delivering IP solutions that meet the needs of our market-leading automotive customers,” said Dino Bekis, vice president of marketing for the IP group at Cadence. “Our expanding portfolio of 16FFC automotive solutions, as well as our Tensilica® DSPs and Verification IP, will enable automotive OEMs and their suppliers to accelerate development and time-to-market of their next-generation SoCs.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- PLDA and GUC Delivers Fully Integrated PCI Express Gen 4 Solution for TSMC's 16nm FinFET Plus Process
- ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process
- Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
- Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology
- Sofics Releases Analog IO's and ESD protection clamps for Advanced Applications using TSMC 7nm FinFET process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |