Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics
Functional safety and data protection features enable more complex SoCs that can meet stringent ISO 26262 standards
CAMPBELL, Calif -- October 04, 2016 -- Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that STMicroelectronics has licensed Arteris FlexNoC interconnect IP along with the FlexNoC Resilience Package.
“As our SoCs continue to become more and more complex with a growing number of IP blocks and larger resulting on-chip interconnects, we are finding that hardware data protection within the interconnect is increasingly required to meet our desired ISO 26262 ASIL levels,” said Fabio Marchio, Automotive and Discrete Group Vice President of STMicroelectronics. “In our never-ending efforts to improve efficiency, we’ve found Arteris technology is helping us meet our safety and time-to-market goals.”
ISO 26262 automotive safety integrity levels (ASIL) are classifications used to help define the requirements necessary for a system to be compliant with the ISO 26262 Functional Safety for Road Vehicles standard. The lowest ASIL is QM, meaning “Quality Management”, and denotes the need for no special safety measures, while the highest safety level, ASIL D, represents the safety level for systems where malfunction could lead to fatal life-threatening injury. The Arteris FlexNoC Resilience Package can be used to create SoCs that meet ISO 26262 ASIL D requirements. Arteris is a member of the U.S. Technical Advisory Group (TAG) to the ISO 26262 TC22/SC32/WG08 working group, helping create safety standards for semiconductors and semiconductor IP.
“We are proud that ST has chosen Arteris interconnect IP technology as the backbone for use in the next generation of automotive SoCs,” said K. Charles Janac, President and CEO of Arteris. “We look forward to working with ST to implement interconnect technologies such as resilience to meet automotive functional safety requirements.”
About Arteris
Arteris, Inc. provides system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Huawei / HiSilicon, Mobileye, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at http://www.arteris.com.
|
Arteris Hot IP
Related News
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
- Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
- Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |