English
TSMC Staffing R&D for 3nm Process
Julien Happich, EETimes
10/4/2016 10:46 AM EDT
PARIS — Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) will actively develop 5-nanometer process technology, while dedicating between 300 and 400 R&D personnel in developing a 3-nanometer process, ultimately aiming at the 1-nanometer manufacturing process, reports Taiwanese magazine CTimes.
In an interview, Dr. Mark Liu, President and Co-Chief Executive Officer of TSMC, said the company will use its three-dimensional stacked architecture technology to break the limitation of Moore's law and move toward the 3nm manufacturing node.
Liu stressed that TSMC has established the complete ecosystems with the intellectual property, automation solutions and equipment providers, and will continue to invest in technology development and research, and to make Taiwan become the strongest fortress in the global semiconductor industry.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Sofics releases its ESD technology on TSMC 3nm process
- MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
- Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
- TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy