Do Chip Designers Worry About the Impact of Power Consumption on Sustainability?
Sonics and Semico Team Up for Power Management Best Practices Survey
San Jose, Calif. – October 3, 2016 – Sonics, Inc. and Semico Research Corporation have launched the “On-Chip Power Management Best Practices” survey. The purpose of this industry survey is to understand how chip designers are managing power consumption and contrast that with expected future best practices. The companies will publish results of the survey on their web sites in the fall of 2016.
Ad |
FlexNoC 5 Network-on-Chip (NoC) FlexNoC Functional Safety (FuSa) Option helps meet up to ISO 26262 ASIL B and D requirements against random hardware faults. |
Not Enough Energy by 2040?
“Energy is a finite resource and reducing its consumption should be everyone’s concern,” said Sonics’ CEO Grant Pierce. “Power is becoming one of the top issues facing chip designers. Semico and Sonics are conducting a survey to better understand today's status quo and tomorrow's trends for power management best practices among chip design teams in semiconductor and electronic systems companies.”
There are predictions from a Semiconductor Industry Association report “Rebooting the IT Revolution: A Call to Action,” that we may run out of energy to power computers by 2040. There are ways to easily save power at the system component and sub-system level and the NRDC has recently published its report, “Slashing Energy Use in Computers and Monitors While Protecting Our Wallets, Health, and Planet,” that provides some amazing statistics about the savings opportunities in PC design.
What is the Power Savings Opportunity at the Chip Level?
Help Sonics and Semico understand power savings practices and trends in chip design. Click here or go to https://goo.gl/forms/45w9cXIMiu7oN5kc2 to take the survey. Survey respondent data will be kept strictly confidential.
About Semico Research Corp.
Semico Research Corp is a semiconductor marketing and consulting research company located in Phoenix, Arizona. Semico was founded in 1994 by a group of semiconductor industry experts. We have improved the validity of semiconductor product forecasts via technology roadmaps in end-use markets. Semico offers custom consulting, portfolio packages, individual market research studies and premier industry conferences.
About Sonics, Inc.
Sonics, Inc. (Milpitas, Calif.) is the trusted leader in on-chip network (NoC) and power management technologies used by the world's top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Based on the ICE-Grain™ Power Architecture, Sonics' ICE-G1™ is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com.
|
Related News
- What worries exec from ARM?
- Chipidea's New USB PHY Architecture for 1.8V Devices Offers Industry's Lowest Power Consumption for SoC Designers
- SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
- Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |