D&R Headline News (Last 14 Days)

Headlines for Thursday Mar. 06, 2025

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EnSilica Secures €2.13 Million European Space Agency Development Contract

EnSilica, a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded a €2.13 million development contract under the European Space Agency’s (“ESA”) Navigation Innovation and Support Programme (“NAVISP”) Element 2 (the “Project”).

• Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
• Infineon brings RISC-V to the automotive industry and is first to announce an automotive RISC-V microcontroller family
• indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
• Silvaco Expands Product Offering with Acquisition of Cadence's Process Proximity Compensation Product Line
• QuantWare raises €20 million Series A to power the world's largest quantum computers
• EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM

Headlines for Wednesday Mar. 05, 2025

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Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems

Omni Design Technologies, a leading provider of high-performance, low-power Swift™ data acquisition and signal-processing solutions and Metanoia, a leading provider of 5G Radio Access Networking (RAN) solutions, partner to offer high performance ultra-low power technology for FR1 and FR2 5G systems.

• AONDevices Partners with Faraday to Enhance Production Capabilities
• MosChip® Launches MosChip DigitalSky GenAIoT™ to Accelerate the Development of Next-Gen Connected, Intelligent Products
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
• Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme
• Quintauris launches the first RISC-V profile for today's real-time automotive applications

Headlines for Tuesday Mar. 04, 2025

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Ceva Collaborates with Arm and SynaXG to Redefine Energy Efficient 5G NR Processing for Sustainable LEO Satellites and 5G-Advanced Wireless Infrastructure

Leveraging Arm Neoverse CPUs, Ceva’s Hardware Accelerated 5G NR Baseband Platform and SynaXG’s 5G NR RAN Expertise, customized baseband processing solution delivers 10X better efficiency than traditional solutions and 20X more efficient than FPGA-based alternatives

• Arm vs. Qualcomm: The Legal Tussle Continues
• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
• Semidynamics' Aliado SDK Accelerates AI Development for RISC-V with Seamless ONNX Integration
• MIPS Drives Real-Time Intelligence into Physical AI Platforms

Headlines for Monday Mar. 03, 2025

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Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals

Ceva today announced that Sharp Semiconductor Innovation Corporation (SSIC), a subsidiary of Sharp Corporation, has developed "ASUKA", a System-on-Chip (SoC) for Beyond 5G (6G) IoT terminals, based on scalable 5G modem platform IP, the Ceva-PentaG2.

• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
• intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs
• CAST Releases First Commercial SNOW-V Stream Cipher IP Core
• eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
• Agile Analog extends leadership in customizable analog security IP with new clock attack monitor
• Weebit Nano - 1H FY25 financial results
• SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS
• GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI

Headlines for Thursday Feb. 27, 2025

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Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications

Built on the successful Ceva-XC20 architecture, already in design with two Tier-1 infrastructure OEMs for 5G-advanced and pre-6G processors, these new DSPs enable faster, more efficient data processing while reducing latency and increasing throughput.

• X-Silicon Revolutionizes AI and Graphics at the Edge with "Constellation" Software Platform
• Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
• SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
• VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs
• Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform
• QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer
• Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications

Headlines for Wednesday Feb. 26, 2025

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Interview with Xiphera CEO - Adapting to Market Changes

The security IP industry is undergoing major changes, driven by ongoing consolidation. In this evolving market, Xiphera - an independent European security IP vendor with an extensive portfolio - remains a Finnish company committed to delivering optimised solutions for the full spectrum of customers’ security needs.

• BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses
• Semiconductor Industry Faces a Seismic Shift
• Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development
• Meet T2M @ MWC 2025 to learn about Cutting-Edge RF, Wireless, Automotive Semiconductor IP Cores & ASIC services

Headlines for Tuesday Feb. 25, 2025

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Andes Technology and proteanTecs Partner to Bring Performance and Reliability Monitoring to RISC-V Cores

This collaboration enables joint customers to seamlessly integrate proteanTecs' on-chip monitoring IP into Andes’ RISC-V processor cores. Customers can then leverage proteanTecs’ real-time analytics software applications to optimize performance, reduce power consumption, detect faults, and enhance overall system reliability, during production and lifetime operation.

• Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration
• Imagination takes efficiency up a level with latest D-Series GPU IP
• Q.ANT and IMS CHIPS Launch Production of High-Performance AI Chips, Establish Blueprint for Strengthening Chip Sovereignty
• sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40%

Headlines for Monday Feb. 24, 2025

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ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%

ZeroPoint Technologies AB today announced a breakthrough hardware-accelerated memory optimization product that enables the nearly instantaneous compression and decompression of deployed foundational models, including the leading large language models (LLMs).

• Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
• Quadric Announces Lee Vick is New VP Worldwide Sales
• Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
• AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing

Headlines for Friday Feb. 21, 2025

• Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors
• Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
• Veriest Solutions Strengthens North American Presence at DVCon US 2025

Headlines for Thursday Feb. 20, 2025

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Intel in advanced talks to sell Altera to Silverlake

Intel is reported by Bloomberg to be at an advanced stage in exclusive negotiations to sell a majority stake in its FPGA unit Altera to private equity fund Silverlake Partners.

• Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
• S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction

Headlines for Wednesday Feb. 19, 2025

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Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results

FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation in automotive, datacenter, consumer electronics, communications and industrial applications.

• YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
• RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models