Moortec to exhibit at the ARM TechCon Expo in Santa Clara
October 12, 2016 -- Moortec will be exhibiting at the ARM TechCon Expo which is taking place in Santa Clara on Wednesday 26th & Thursday 27th of October. The ARM TechCon Expo is a unique opportunity for attendees to learn about groundbreaking solutions, reach out and touch the latest innovations and identify cutting-edge technologies.
Come and meet us at booth 808 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec’s high performance analog IP.
Moortec specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors on 28nm and FinFET. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
|
Related News
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the REUSE 2017 Expo in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec to exhibit at the 2017 TSMC NA Technology Symposium in Santa Clara
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |