Moortec to exhibit at the ARM TechCon Expo in Santa Clara
October 12, 2016 -- Moortec will be exhibiting at the ARM TechCon Expo which is taking place in Santa Clara on Wednesday 26th & Thursday 27th of October. The ARM TechCon Expo is a unique opportunity for attendees to learn about groundbreaking solutions, reach out and touch the latest innovations and identify cutting-edge technologies.
Come and meet us at booth 808 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec’s high performance analog IP.
Moortec specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors on 28nm and FinFET. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
|
Related News
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the REUSE 2017 Expo in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec to exhibit at the 2017 TSMC NA Technology Symposium in Santa Clara
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |