Hisense selects their SoC Fabric for IoT from Dolphin Integration
Grenoble, France – Shanghai, China – October 24, 2016 -- Launching any SoC on a highly competitive market demands a differentiation for which Hisense was searching for an ultra low-power solution to extend battery life-time of wireless-connected devices. Designing such an integrated circuit introduces new challenges: silicon area, power consumption and BoM cost must be aggressively reduced, while dealing with noise issues in a mixed-signal SoC embedding multiple power domains with diverse power modes.
Dolphin Integration’s SoC Fabric offering covers the SoC networks of clocks and regulated voltages, for a SoC designed with power domains, to deal with these new challenges.
“When we first discovered Dolphin Integration, we had in mind to acquire some vital Silicon IPs. Their intensive pre-sales support made us realize that they could provide us with a complete set of SoC Fabric IPs together with the transfer of know-how for implementing safely our low-power SoC.” explained Shawn Zhong, CEO of Hisense Microelectronics.
Dolphin Integration's SoC Fabric firstly stars their library of voltage regulators, compliant with the 8 rules of DELTA to enable mix-and-match from diverse regulator suppliers. Their second contribution automatically manages the in-rush current to share a regulator between multi-mode power domains with their patented "Transition Ramp Controllers". The third innovation was needed to build fast and safely the Activity Control Unit of a SoC with multi-mode power domains, thanks to a kit of modules in the always-on domain.
“We are pleased to announce Hisense as a licensee for our SoC Fabric IPs” said Frédéric Renoux, Sales Director at Dolphin Integration. “For their foundry partner and for Hisense themselves, our innovative and silicon-proven SoC Fabric reduces the Time-to-Market of leading edge and robust low-power SoCs at TSMC 55 nm uLP/uLPeF”.
For both the foundry and the IP provider, proving on silicon a SoC Fabric required the block-busting innovation of a Demochip: code-named TaiShan, it provides IP Compatibility Insurance (IPCI) for an assembly of Silicon IP in dynamic interplay while proving the robustness of such SoC Fabric IPs.
I want more information about these offering
About HiSense
Hisense Microelectronics is committed to bringing its customers semiconductor solutions that can differentiate their end products with rich features so that they can build and grow successful businesses today and in the future. It designs, develops, and supplies a range of semiconductor solutions that comprise advanced image processing, human machine interaction and IoT connectivity. Applications for the products include the following end markets: smart TVs, new display terminals such as ultra short-throw laser projection TVs and medical displays, and smart home appliances.
About Dolphin Integration
Dolphin Integration contributes to "enabling low-power Systems-on-Chip" for worldwide customers - up to the major actors of the semiconductor industry - with high-density Silicon IP components best at low-power consumption.
"Foundation IPs" includes innovative libraries of standard cells, register files and memory generators as well as an ultra-low power cache controller. "Fabric IPs" of voltage regulators, Power Island Construction Kit and their control network MAESTRO enable to safely implement low-power SoCs with the smallest silicon area. They also star the "Feature IP": from ultra-low power Voice Activity Detector with high-resolution converters for audio and measurement applications to power-optimized 8 or 16 and 32 bit micro-controllers.
Over 30 years of experience in the integration of silicon IP components, providing services for ASIC/SoC design and fabrication, with its own EDA solutions, make Dolphin Integration a genuine one-stop shop addressing all customers' needs for specific requests.
It is not just one more supplier of Technology, but the provider of the Dolphin Integration know-how!
|
Dolphin Design Hot IP
Related News
- Live webinar by Dolphin Integration: how to design an energy-efficient SoC in advanced nodes for increasing battery lifetime for IoT applications
- INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash
- GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
- Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
- Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |