BrainChip Raises A$5.355 Million Through an Oversubscribed Placement
ALISO VIEJO, CA -- October 27, 2016 -- BrainChip Holdings Ltd ("BrainChip" or the "Company") (ASX: BRN), a leading provider of software and hardware accelerated solutions for Advanced Artificial Intelligence and Machine Learning applications, is pleased to announce that it has successfully raised A$5.355 million through an oversubscribed placement to institutional and sophisticated investors.
The placement, which was initially expected to raise between A$3 million and A$4 million, was priced at A$0.18 per share. This price reflected a 25% discount to the 30-day volume weighted average price (VWAP). The price was at a 20% premium to the Company's last capital raise.
This placement provides management the resources necessary to recruit top-tier sales and marketing talent and drive revenue growth. As the Company accelerates commercial deployment of its solutions in Civil Surveillance, Gaming, Facial Recognition and Visual Inspection it is essential to have highly skilled sales, marketing and application engineers engaged with customers.
"The BrainChip story resonates well with the investment community and we have received great support from institutional and sophisticated investors in this placement," said BrainChip's Chief Executive Officer, Louis DiNardo.
"This capital raise gives us the resources necessary to build a world-class sales and marketing team and further new product development. We are pleased to welcome a key group of shareholders to our register who are long-term supporters of the Company."
Substantial shareholder Metals X Limited has shown its support in BrainChip by subscribing to the placement to maintain its current equity position.
The Shares issued under the Placement will be issued pursuant to the Company's 15% placement capacity under Listing Rule 7.1. An Appendix 3B and a Cleansing Notice will be lodged with the ASX following the issue of the securities.
About BrainChip Holdings Ltd (ASX: BRN)
BrainChip Holdings Ltd, is a leading provider of software and hardware accelerated solutions for Advanced Artificial Intelligence and Machine Learning applications. The Company's Spiking Neural Networking Processor (SNAP) learns autonomously with a small sample set and provides real-time information for data analytics in image and video processing applications. The Company provides software and hardware solutions that address the high-performance requirements in Civil Surveillance, Gaming, Facial Recognition and Visual Inspection systems.
|
Related News
- Chartered raises $300 million through private placement
- Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
- Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
- SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |