English
Agilent Technologies has licensed 3DSP's family of DSP cores
 |
DSP licences
By David Larner, Embedded Systems
September 26, 2001 (9:13 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010926S0018
Agilent Technologies has licensed 3DSP's family of DSP cores for use in developing next-generation system-on-chip (SOC) products for wireless phones, personal digital assistants and other advanced communications and mobile appliance applications. Agilent will get access to the SP-3, SP-5 and SP-5flex cores and the DSP-Shuttle intelligent bus controller.
Related News
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
- Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs
- Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
- Tensilica's Diamond Standard 330HiFi Audio DSP Licensed by Fujitsu Microelectronics for Portable Consumer Electronics
- ParthusCeva's DSP Cores Licensed by STMicroelectronics for DSL Chipsets
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
|
E-mail This Article | 
|
|
Printer-Friendly Page |