English
Agilent Technologies has licensed 3DSP's family of DSP cores
 |
DSP licences
By David Larner, Embedded Systems
September 26, 2001 (9:13 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010926S0018
Agilent Technologies has licensed 3DSP's family of DSP cores for use in developing next-generation system-on-chip (SOC) products for wireless phones, personal digital assistants and other advanced communications and mobile appliance applications. Agilent will get access to the SP-3, SP-5 and SP-5flex cores and the DSP-Shuttle intelligent bus controller.
Related News
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
- Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs
- Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
- Tensilica's Diamond Standard 330HiFi Audio DSP Licensed by Fujitsu Microelectronics for Portable Consumer Electronics
- ParthusCeva's DSP Cores Licensed by STMicroelectronics for DSL Chipsets
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |