D&R Headline News (Last 14 Days)

Headlines for Friday Feb. 21, 2025

• Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
• Veriest Solutions Strengthens North American Presence at DVCon US 2025

Headlines for Thursday Feb. 20, 2025

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Intel in advanced talks to sell Altera to Silverlake

Intel is reported by Bloomberg to be at an advanced stage in exclusive negotiations to sell a majority stake in its FPGA unit Altera to private equity fund Silverlake Partners.

• Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
• S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction

Headlines for Wednesday Feb. 19, 2025

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Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results

FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation in automotive, datacenter, consumer electronics, communications and industrial applications.

• YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
• RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models

Headlines for Tuesday Feb. 18, 2025

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AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset

AccelerComm's innovative use of vector processing cores for signal processing moves 5G satellite beyond proof-of-concept stage delivering 30X performance improvement over single chip integrated solution, with roadmap to scale to 400X.

Headlines for Monday Feb. 17, 2025

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TSMC Will Not Take Over Intel Operations, Observers Say

TSMC will not take over the chipmaking operations of struggling U.S. rival Intel, according to industry analysts.

• ARM signs Meta as first chip product customer, says report
• Blueshift Memory starts £2.77 million development project with AP Memory and Syntronix of Taiwan

Headlines for Friday Feb. 14, 2025

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Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company

QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interconnect solutions, has announced today that it has signed an IP licensing agreement with a leading Korean system semiconductor design company.

Headlines for Thursday Feb. 13, 2025

• Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation
• Paras Defence Invests in Logic Fruit Technologies to Boost Defence Tech Capabilities at AERO India 2025
• Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
• Ceva, Inc. Announces Fourth Quarter and Full Year 2024 Financial Results

Headlines for Wednesday Feb. 12, 2025

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Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership

Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.

• Could Thomas Caulfield lead Intel or a merged Intel-GloFo?
• Semiconductor Giants Navigate AI Boom & Trade War
• OpenAI to tape-out on TSMC 3nm this year

Headlines for Tuesday Feb. 11, 2025

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ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio

Ceva today announced that ListenAI Technology (ListenAI), a pioneering leader in intelligent terminal system-on-chip (SoC) solutions, has licensed the Ceva-Waves Wi-Fi 6 IP to enhance its portfolio of Edge AI processors.

• intoPIX Drives Innovation in Automotive Ethernet and Data Transmission
• Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex

Headlines for Monday Feb. 10, 2025

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Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design

A member of the TSMC Open Innovation Platform® (OIP) Ecosystem for over 12 years, Silicon Creations has won the TSMC OIP Partner of the Year award for eight consecutive years, demonstrating its leadership in the field and commitment to innovation.

• Onsemi's Treo Taps Weebit ReRAM
• Gelsinger Invests In British AI Chip Startup Fractile
• Qualcomm says Arm has withdrawn license breach notice
• QuickLogic Integrates Synopsys Synplify Synthesis for Best-in-Class Quality of Results
• QuickLogic Unveils Aurora 2.9: Enhanced Performance and Seamless Integration
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• TSMC January 2025 Revenue Report and the Statement on the Impact of Earthquake
• Logic Fruit Announces Strategic Partnership with PACE at Aero India 2025
• SoftBank in talks to buy server chip firm Ampere
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024
• Veriest Solutions Strengthens North American Presence at DVCon US 2025
• T2M IP Announces Licensing of ASIL-B Qualified CAN XL, QSPI, LIN 2.0, I2C IP Cores to Leading Automotive Customer

Headlines for Friday Feb. 07, 2025

• UMC Reports Sales for January 2025
• High-Performance 16-Bit ADC and DAC IP Cores Now Available for Licensing

Headlines for Thursday Feb. 06, 2025

Top Story

Why UCIe is Key to Connectivity for Next-Gen AI Chiplets

Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.

• Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
• CHERI Protects Memory at the Hardware Level
• Axiomise Launches footprint, Area Analyzer for Silicon Design