ST's Bozotti on 'back-to-silicon' differentiation
By Peter Clarke, EETimes Europe
November 15, 2016
Carlo Bozotti, CEO of STMicroelectronics NV, has presided over a difficult period in the chip company's history as he first put together the ST-Ericsson mobile processors joint venture and then had to engineer ST's exit from what had became an ill-fated project. But now the write-offs, reorganizations and product phase outs are just about behind the company and it is starting to resume growth. EE Times Europe interviewed Bozotti at a bustling Electronica in Munich.
"The market is on an upturn, despite an IMF revision taking down global GDP forecast," said Bozotti. "We saw a good trend in bookings in Q3 and this continued in October and the upturn is broad."
But an examination of the numbers shows ST's main business group revenues were still marginally down in Q3 compared with a year before. The overall revenue increase was largely down to success with a time-of-flight ranging image sensor that, for now, is part of the "others" product group.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards