Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
New Ultrasound Technology Directly Embeds Arrays of Piezoelectric Transceivers to Create New Touch-Sensitive Panels and Metal Casings for Mobile Devices
SAN JOSE, Calif. -- Dec 15, 2016 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Sentons licensed the Cadence® Tensilica® ConnX BB32EP DSP for a new ultrasound technology that is dramatically changing the human interface landscape for mobile and touch-enabled devices. Sentons selected the ConnX DSP for its unparalleled complex signal processing performance in a low-power envelope for mobile applications. The optimized DSP software library and fully integrated toolchains for processor and software development enabled Sentons to focus on their advanced interface technology and achieve rapid time to market.
“Mobile device manufacturers are seeking new ways to innovate and improve the user interface capabilities in their products. Replacing commodity capacitive technologies with Sentons’ ultrasound-based sensing technology enables the application of touch sensing not only on glass but also on metal and curved surfaces. It also allows force and pressure sensing with zero deformation of the touch surface,” said Sam Sheng, CEO at Sentons. “This technology is centered around sophisticated new algorithms running on the Cadence Tensilica ConnX BB32EP DSP. A powerful 32-way MAC SIMD, 5-issue VLIW DSP with outstanding support for complex vector and matrix advanced algebra, the BB32EP’s high performance and low power were the perfect match for Sentons’ new SoC.”
“Sentons’ highly innovative signal processing was enabled by a Tensilica heterogeneous multicore solution including the ConnX BB32EP and an Xtensa® controller that provides outstanding complex signal processing performance in a low-power envelope for mobile applications,” said Chris Jones, group director of DSP Marketing at Cadence. “Supported by a complete, industry-proven set of tools and libraries, Tensilica provided an ideal solution for Sentons’ new ultrasound technology.”
For more information about the Tensilica ConnX BB32EP DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Cadence Licenses Tensilica ConnX BBE16 DSP to GCT Semiconductor
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
- New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications
- Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |