Wi-Fi Expands with .11ax at CES
Kevin Krewell, Principal Analyst, Tirias Research
EETimes (1/2/2017 02:20 PM EST)
As we approach the yearly post-New Year's Eve torture that is CES, one piece of good news is Wi-Fi is about to get better.
A new revision of the standard focused on supporting greater client density should begin to roll out in 2017 – 802.11ax. At CES 2017, we expect to hear about silicon support for 802.11ax and maybe see a few access points supporting it.
Current state-of-the-art wireless routers are based on the 802.11ac Wave-2 standard with multi user (MU) MIMO and 4x4 antenna arrays. They enable spatial reuse to minimize channel sharing among multiple simultaneous users. The marketing for these systems is typically based on their peak data rates to clients, but their most important benefit is increased capacity and improved user experience in crowded networks.
E-mail This Article | Printer-Friendly Page |
Related News
- Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications
- Palma Ceia SemiDesign Tapes Out 802.11ax Transceiver for Wi-Fi 6
- AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity
- CEVA Announces Industry's First 802.11ax Wi-Fi IPs
- Qualcomm Announces First End-to-End 802.11ax Wi-Fi Portfolio
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards