Qualcomm Feels Smartphone Squeeze
Rick Merritt, SiliconValley Bureau Chief
EETimes (1/21/2017 02:00 AM EST)
The salad days of the smartphone era are over, now stakeholders are fighting over pieces of red meat.
Apple is suing Qualcomm for $1 billion in damages from unfair patent practices. The suit filed January 20 in the U.S. District Court for the Southern District of California was widely reported by Reuters and other sources.
In a press statement quoted in a Forbes article, Apple said, “after years of disagreement over what constitutes a fair and reasonable royalty we have no choice left but to turn to the courts.”
Companies hate to go to court. It’s expensive and business details they would prefer to remain confidential get revealed to the public. But as growth slows, the pressure for profits rises so it was perhaps just a matter of time before royalties became a battleground.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Insufficient baseband chip supply hurting LTE smartphone sales
- Arm's power play will backfire
- Arm puts Qualcomm on notice of cancellation of its licence
- Qualcomm and Sequans Complete Sale of 4G IoT Technology
- Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards