Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology
Scalable architecture paves the way for transition to 400GbE Ethernet
SUNNYVALE, Calif. – February 1, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced its industry-leading 56G SerDes PHY which delivers enterprise-class performance across the challenging signal environments typical of high-speed communication systems. Developed on cutting-edge second generation FinFET (Fin Field Effect Transistor) process technology, this solution meets the growing demands of communications and data center applications. The new 56G SerDes PHY also provides both PAM-4 and NRZ signaling with a scalable and flexible ADC-based (analog-to-digital converter) architecture to address long-reach backplane requirements for the industry transition from 100Gb to 400Gb Ethernet applications.
“To meet the growing demand for high-speed Ethernet, we have developed a scalable new architecture to address the future requirements of higher speeds and increased bandwidth,” said Luc Seraphin, senior vice president and general manager of the Rambus Interface division. “Developing on advanced FinFET technology allows us to deliver low-power solutions and a higher degree of integration to support challenging networking ASIC designs. This technology also addresses process challenges and is capable of supporting demanding systems with extended product lifecycles.”
The industry-standard interface offering at Rambus are high-quality, complete PHY solutions designed with a system-oriented approach to maximize flexibility in today’s most challenging system environments. For additional information, please visit rambus.com/serdes.
For additional information on Rambus products and solutions, please visit rambus.com.
About Rambus Interface Division
The Rambus Interface division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
|
Related News
- Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process
- Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers
- Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
- Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process
- OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |