GUC Unveils Solid State Drive ASIC Capabilities
Total solution covers front end design to packaging capabilities and targets TSMC 28nm process technologies
Hsinchu, Taiwan, February 02, 2017 - Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM today rolled out its complete portfolio of solid state drive (SSD) ASIC capabilities.
The company's SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC 28HPC+ process technologies.
The IP set targeting ultra-low power and small footprint to enable customer with the best power and cost advantages, which includes (LP)DDR3/4 controller/PHY, ONFI 3/4 PHY, PCIe-3 PHY along with PLL, AFE, thermal sensor, VMK. Front-end IP from partner includes NVMe, LDPC, Security engine and ARM Cortex-R4, etc. Furthermore, GUC also provides FPGA system emulation kit, packaging and PCB SI/PI design service for customer quick time-to-market.
GUC's SSD ASIC capabilities were proven over the course of last year when the customer released multiple SSD products manufactured on TSMC's 28HPC+ process using GUC’s SSD platform.
"The ability of our innovative design services capability to overcome the challenge of integrating a customer's design with third-party and GUC IP is the key to achieving superior time-to-market and time-to-tape-out results, "explains C.J. Liang, GUC's Senior Vice President of R&D.
"The GUC SSD ASIC solution represents a one-of-a-kind service that is not available anywhere else. We successfully cooperated with third-partners on a FPGA platform build-up and SoC integration/ design/verification process. Our end-to-end approach delivers a seamless experience that results in better yield and faster time-to-market, "explained Ken Chen, President of GUC.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
|
Related News
- JEDEC Publishes Automotive Solid State Drive (SSD) Device Standard
- Mobiveil Inc. and Crossbar Inc. Announce Partnership to Apply Mobiveil's NVMe Solid State Drive IP to Crossbar's ReRAM IP blocks
- GUC Rolls Out New Low Power Solid State Drive IP Portfolio
- Mobiveil Announces the Availability of All Key IP Components and Subsystem for an Integrated NVM Express Based PCIe-SSD Solution
- VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |