UMC to Start 14nm Shipments in Q1
Peter Clarke, EETimes
2/2/2017 12:05 PM EST
LONDON--Taiwanese foundry United Microelectronics Corp. (UMC) plans to start shipments of its 14nm FinFET in the first quarter of 2017, according to the company's CEO.
This represents a general acceleration of UMC's plans to bring the manufacturing process to market. In April 2016, UMC was talking about commercial production in the second half of 2017. In October 2016, UMC reportedly discussed moving the process to volume production in 2Q17 with Bitcoin mining company BitFury set to be the first customer.
In conference call to discuss UMC's 4Q16 financial results, Po Wen Yen, CEO of UMC, said: "With regard to our advanced 14-nanometer technology, we have recently made substantial progress for this advanced node. Following intensive engineering activities with our customer, UMC’s 14-nanometer transistor performance has delivered speed and leakage results which are comparable with the industry’s 14-nanometer standards. Our yields have fulfilled customer requirements, and we anticipate 14-nanometer wafer shipments to commence in first quarter 2017, highlighting our determined efforts to reach this important milestone."
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017
- First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
- Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset