UMC to Start 14nm Shipments in Q1
Peter Clarke, EETimes
2/2/2017 12:05 PM EST
LONDON--Taiwanese foundry United Microelectronics Corp. (UMC) plans to start shipments of its 14nm FinFET in the first quarter of 2017, according to the company's CEO.
This represents a general acceleration of UMC's plans to bring the manufacturing process to market. In April 2016, UMC was talking about commercial production in the second half of 2017. In October 2016, UMC reportedly discussed moving the process to volume production in 2Q17 with Bitcoin mining company BitFury set to be the first customer.
In conference call to discuss UMC's 4Q16 financial results, Po Wen Yen, CEO of UMC, said: "With regard to our advanced 14-nanometer technology, we have recently made substantial progress for this advanced node. Following intensive engineering activities with our customer, UMC’s 14-nanometer transistor performance has delivered speed and leakage results which are comparable with the industry’s 14-nanometer standards. Our yields have fulfilled customer requirements, and we anticipate 14-nanometer wafer shipments to commence in first quarter 2017, highlighting our determined efforts to reach this important milestone."
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017
- First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
- Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks