Intel Shows 2.5D FPGA at ISSCC
EMIB forms lower cost 2.5D bridge
Rick Merritt, EETimes
2/7/2017 00:01 AM EST
SAN FRANCISCO – Intel gave the most detailed look at its lower cost alternative to 2.5D packaging in a paper on its Stratix X FPGA at the International Solid State Circuits Conference (ISSCC) here. In the same session, AMD showed its Zen x86 processor sports a 10 percent smaller die than Intel’s latest 14nm CPUs.
The Stratix X uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) to link the FPGA with four external transceivers. The bridge is made using silicon die mounted in a BGA substrate which is significantly smaller than the silicon substrates used in the CoWoS process developed by TSMC and used by rival FPGA vendor Xilinx and GPU designer Nvidia.
EMIB uses a combination of 55 micron micro-bumps and 100+ micron flip-chip bumps to support up to 24 transceiver channels with 96 I/Os each. They deliver 2 Gbits/second/pin at 1.2 pJ/bit/die using a proprietary protocol.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
- Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP
- Intel Launches Altera, Its New Standalone FPGA Company
- ADTechnology to start 3nm 2.5D ASIC design project for HPC application
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era