Fujitsu, Toshiba report on merged SoC efforts
Fujitsu, Toshiba report on merged SoC efforts
By Yoshiko Hara, EE Times
October 22, 2002 (7:40 a.m. EST)
URL: http://www.eetimes.com/story/OEG20021021S0036
TOKYO Fujitsu Ltd. and Toshiba Corp. have provided a progress report on their system-on-chip (SoC) collaboration efforts, which have been shadowed by rumors of a break-up since they were first announced in June.
"Some parts of the collaboration have started and we can now show the guidelines of the collaboration," a Toshiba spokesman said.
The final form of the companies' merged system LSI operations is still not clear, however, and the companies said they are still discussing whether they will form a single unified operation.
Fujitsu and Toshiba said they are focusing on three areas where collaboration is most practical: the joint development of a design infrastructure for 90-nanometer nd 65-nm products; the joint development of advanced process technologies for 90-nm and 65-nm generation devices; and the possible development of SoC solutions. While some SoC application areas have been chosen, the companies said the r ange is still broad, including such areas as digital home networks and mobile networks.
In one sign of progress, the companies said engineers from both companies are working together to develop common intellectual property (IP) cores for USB, PCI, serial interfaces, image/video-related applications, encryption technologies, D/A converters, A/D converters and PLLs.
The companies intend to complete their plans by the end of the next fiscal year in March 2004.
Related News
- Fujitsu, Toshiba extend partnership to SoC IP
- Fujitsu and Toshiba said to be discussing linking SOC operations
- Toshiba's "Easy Prototyping" Solution for Custom SoC Development Platform Reduces Need for Customer's Own Design Resources
- Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
- Synopsys' IC Compiler II Enables Toshiba's Tapeout of Complex 40-nm SoC, Proves out Game-Changing Capabilities
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |