Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8
10nm process node, Gigabit LTE come to smartphones
Junko Yoshida, EETimes
2/27/2017 01:00 AM EST
BARCELONA – Qualcomm, Samsung and MediaTek, three leading smartphones chip vendors, have come to the Mobile World Congress (MWC) here this week to showcase advanced new modems and apps processors designed to power next-generation smartphones.
Nobody knows exactly what Apple has up its sleeve for the upcoming iPhone 8 in the iPhone’s tenth birthday. But gleaning from new technologies launched at the MWC, we have some idea of what to expect in Apple’s iPhone 8.
The use of the10nm process technology – common to all three chips announced by Qualcomm, Samsung and MediaTek – and faster speeds in downlink and uplink enabled by the advanced LTE modem -- led by Qualcomm -- are two likely elements to be leveraged in iPhone 8.
E-mail This Article | Printer-Friendly Page |
Related News
- iPhone 8 Still Packs Qualcomm, NXP
- Qualcomm, MediaTek Fill Vacuum HiSilicon Left in Smartphones
- New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce
- MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV
- Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards