Moortec to exhibit at the 2017 TSMC NA Technology Symposium in Santa Clara
March 7th, 2017 -- Moortec Semiconductor will be exhibiting at the 2017 TSMC NA Technology Symposium on Wednesday 15th March. The event is taking place at the Santa Clara Convention Center, so why not come and meet us at booth #508 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec’s high performance In-Chip Sensors.
Moortec provide market-leading embedded monitoring IP subsystems for today’s technologies and specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis and offers support for AVS/DVFS.
If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.
Moortec offer a range of monitoring IP on TSMC 28nm HPC, HPC+ & HPM and have recently announced the availability of their embedded Process, Voltage and Temperature monitoring IP on TSMC’s 16FFC/FF+ process.
Moortec are also the current holders of the TSMC Open Innovation Platform Partner of the Year Award for the New IP category.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
If you would like to arrange a meeting at the event please contact Ramsay Allen on +44 1752 875133 or email: ramsay.allen@moortec.com
For more information please visit www.moortec.com
|
Related News
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the REUSE 2017 Expo in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
- Moortec to exhibit at the 2017 TSMC Europe OIP Ecosystem Forum and Technology Symposium in Amsterdam
- Moortec to exhibit at the 2017 TSMC China Technology Symposium in Shanghai
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |