CMOS Micro Device announces a breakthrough in low power high density CAM technology
CAMPBELL, Calif. -- October 22, 2002 -- CMOS Micro Device, Inc. (CMD), a leading developer of high speed, low power Ternary Content Addressable Memory (TCAM) technology, today announced availability of a preliminary design for its new 18-megabit density, low power consumption, 250 million search per second CMD250HDLP Full Ternary CAM.
The CMD250HDLP design uses conventional CMOS logic process, and a proprietary design technique. The new 18-megabit TCAM accommodates the requirements of major router providers for their next generation products.
When operating at 250 million searches per second for the full chip searching:
• Peak power consumption is below 5 watts.
• Normal operating power is approximately 2.5 watts.
The CMD250HDLP rapidly follows the CMOS Micro Device 2-megabit 400 million search per second CMD400, announced July 1, 2002. With proprietary scalable pipeline architecture and circuit techniques, CMOS Micro Device SRAM-based Ternary CAMs have more than three times the performance of today's leading products with similar processing technology.
"Our technology provides an alternative to lower the cost and shorten the time to market for other CAM venders and companies that need embedded CAM," says Paul Huang, the Chief Technical Officer of CMOS Micro Device, Inc.
The new CMOS Micro Device CMD250HDLP TCAM meets the common system requirements for high performance applications in the networking industry including high-end routers and switches, multi-layer searches, Ethernet switches, longest prefix matching, Quality of Service, Voice over IP and Virtual Private Networks.
The CMD250HDLP will be available by the second half of 2003. Preliminary design for licensing is available now.
Founded in 2000, CMOS Micro Device, Inc. is a privately held fabless semiconductor chip and IP design provider that develops and markets Ternary CAM for network routers and switches.
Contact: Paul Huang, CMOS Micro Device, Inc., 1901 South Bascom Avenue, Suite 1030, Campbell, CA 95008. Phone (408) 559-0909. Fax (408) 559-0949.
|
Related News
- Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices
- Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications
- M31 high density and low power IP solutions on TSMC 55nm embedded flash technology
- Dolphin Integration announces its ultra low power, low leakage and High density 65 nm ROMs and RAMs
- Brand new 32-bit RISC core: XAP3 ASIC processor liberates embedded systems industry with very high code density, low power and software flexibility
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
Most Popular
E-mail This Article | Printer-Friendly Page |