Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
ST's SPAD Imager Likely Linked to iPhone 8
Apple in Grenoble, ST's IEDM paper, $1B CapEx
Junko Yoshida, EETimes
3/21/2017 01:59 PM EDT
LYON, France — Apple’s upcoming iPhone 8 — allegedly featuring a “3D camera” — has been the subject of intense speculation among the media and the financial community for months.
The dots in this puzzle that have yet to be connected are the explicit relationships among the iPhone 8, single photon avalanche diodes (SPAD) and a company in Europe — STMicroelectronics.
Obviously, any connection that would identify Apple as an ST customer is one that ST wouldn't touch with a ten-foot diode. ST, ergo, is mum.
However, Yole Développement, a Lyon-based market research firm with strong focus on technology analysis, recently drew an almost unbroken line from dot to dot. Yole’s educated guess is that ST is bringing a brand new 3D (array) imager to Apple iPhone 8 — an innovation that will alter the phone’s user interface.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Vector Informatik and Synopsys Announce Strategic Collaboration to Advance Software-Defined Vehicle Development
- Allegro DVT Launches its First AI-Based Neural Video Processing IP
- Weebit Nano fully qualifies ReRAM module to AEC-Q100 for automotive applications
- Rambus Enhances Data Center and AI Protection with Next-Gen CryptoManager Security IP Solutions
- Crypto Quantique demonstrating device security platform that accelerates CRA-compliant development
Most Popular
- Axelera AI Secures up to €61.6 Million Grant to Develop Scalable AI Chiplet for High-Performance Computing
- Arm vs. Qualcomm: The Legal Tussle Continues
- Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric
- Synopsys Introduces Virtualizer Native Execution on Arm Hardware to Accelerate Software-defined Product Development
- Imagination GPU Powers Renesas R-Car Gen 5 SoC