ST's SPAD Imager Likely Linked to iPhone 8
Apple in Grenoble, ST's IEDM paper, $1B CapEx
Junko Yoshida, EETimes
3/21/2017 01:59 PM EDT
LYON, France — Apple’s upcoming iPhone 8 — allegedly featuring a “3D camera” — has been the subject of intense speculation among the media and the financial community for months.
The dots in this puzzle that have yet to be connected are the explicit relationships among the iPhone 8, single photon avalanche diodes (SPAD) and a company in Europe — STMicroelectronics.
Obviously, any connection that would identify Apple as an ST customer is one that ST wouldn't touch with a ten-foot diode. ST, ergo, is mum.
However, Yole Développement, a Lyon-based market research firm with strong focus on technology analysis, recently drew an almost unbroken line from dot to dot. Yole’s educated guess is that ST is bringing a brand new 3D (array) imager to Apple iPhone 8 — an innovation that will alter the phone’s user interface.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset