China's Tsinghua Secures $22 Billion in State Backing
Dylan McGrath, EETimes
4/4/2017 05:01 PM EDT
SAN FRANCISCO—China's Tsinghua Unigroup Ltd. announced it secured deals that would provide it with an additional 150 billion yuan (about $21.8 billion) in financing from two government-backed sources.
The China Development Bank pledged 100 billion yuan (about $14.5 billion) in financing while China's Integrated Circuit Investment Fund will invest up to 50 billion yuan (about $7.3 billion) in China's largest semiconductor company, according to a statement posted by Tsinghua in late March.
Tsinghua said the financing was provided to the company for upgrades and to enhance its core competitiveness.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
- China's Unigroup plans to spend $60 billion, says report
- Tsinghua to Build $30 Billion Memory Fab in China
- 4 Reasons for Intel's $1.5 Billion Bet in China
- IPextreme Secures $6M 'Series A' Funding from Alloy and SmartForest
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks