Bluetooth low energy v6.0 Baseband Controller, Protocol Software Stack and Profiles IP
China's Tsinghua Secures $22 Billion in State Backing
Dylan McGrath, EETimes
4/4/2017 05:01 PM EDT
SAN FRANCISCO—China's Tsinghua Unigroup Ltd. announced it secured deals that would provide it with an additional 150 billion yuan (about $21.8 billion) in financing from two government-backed sources.
The China Development Bank pledged 100 billion yuan (about $14.5 billion) in financing while China's Integrated Circuit Investment Fund will invest up to 50 billion yuan (about $7.3 billion) in China's largest semiconductor company, according to a statement posted by Tsinghua in late March.
Tsinghua said the financing was provided to the company for upgrades and to enhance its core competitiveness.
E-mail This Article | Printer-Friendly Page |
Related News
- Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
- China's Unigroup plans to spend $60 billion, says report
- Tsinghua to Build $30 Billion Memory Fab in China
- 4 Reasons for Intel's $1.5 Billion Bet in China
- IPextreme Secures $6M 'Series A' Funding from Alloy and SmartForest
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets