Rambus Joins Microsemi's SoC Partner Program
DPA countermeasures secure systems against threats in mission-critical applications
SUNNYVALE, Calif.-- May 10, 2017 -- Rambus Inc. (Nasdaq:RMBS) today announced it has joined the System-on-Chip (SoC) Partner Program of Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. Microsemi field programmable gate array (FPGA) customers can now select advanced security solutions developed by Rambus to protect against side-channel attacks for highly sensitive markets, including aerospace and avionics.
The Partner Program agreement includes all differential power analysis (DPA) solutions developed by Rambus including its DPA Resistant cryptographic cores and DPA Resistant software libraries.
“With the threat of side-channel attacks and other cybersecurity threats on the rise, our relationship with Rambus allows customers to inherently protect their valuable design intellectual property (IP), sensitive data and embedded systems, and ensures the rigorous security requirements of our defense, communications and industrial customers are being met,” said Bruce Weyer, vice president and business unit manager at Microsemi. “We look forward to an ongoing collaboration with Rambus so we can jointly deliver proven security solutions to our customers.”
As part of Microsemi's SoC Partner Program, Rambus will join other independent providers in providing FPGA design services and embedded software/hardware products supporting Microsemi devices. The program provides engineers with access to additional design resources, expertise and products from Microsemi's network to enable faster time to market.
“Microsemi and Rambus have collaborated together on security technology for several years, and the company was an early licensee of our security offerings,” said Eric Spanneut, vice president of the Rambus Security Division. “Customers now have an option to add our proven security solutions into Microsemi FPGAs to mitigate the threat of DPA—a significant vulnerability in chip security facing multiple end markets, including mission-critical applications found in government and military settings. We are excited to team with Microsemi to deliver the right products, tools and services to keep customer products secure.”
DPA is a side-channel attack that monitors variations in the electrical power consumption or electromagnetic emissions from a target device. These measurements (or traces) can be used to obtain cryptographic keys and other sensitive information from semiconductors. The Rambus DPA Resistant cores and software libraries are designed to protect against side-channel attacks, are validated to resist DPA attacks up to 100 million traces, and can be optimized for size, speed and security level.
For additional information, please visit www.rambus.com/security/dpa-countermeasures/.
About Rambus Security
Rambus Security is dedicated to providing a secure foundation for a connected world. Our innovative solutions span areas including tamper resistance, network security, mobile payment, smart ticketing and trusted transaction services. Rambus foundational technologies protect nearly nine billion licensed products annually, providing secure access to data and creating an economy of digital trust between our customers and their customer base. Additional information is available at rambus.com/security.
About Rambus
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com.
|
Related News
- MIPS Joins Renesas Electronics' SoC Partner Program
- Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
- Xiphera joins Microchip Technology's FPGA Design Partner program
- Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus
- IC'Alps joins Arm Approved Design Partner program to better support customers with ASIC development
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |