Samsung Spinoff Likely to Grab Foundry Share
Alan Patterson, EETimes
5/16/2017 01:29 PM EDT
TAIPEI — Samsung Electronics’ plan to spin off foundry operations from the system LSI division is expected to increase Samsung’s share of global contract chipmaking at the expense of Taiwan Semiconductor Manufacturing Co. (TSMC) and smaller rivals.
Samsung's chip operations, consisting of memory and system LSI, will be split into three, making the foundry business an independent unit, according to the Korea Economic Daily.
The separation of Samsung’s contract chipmaking from its branded semiconductor business would remove a conflict of interest with potential customers such as Nvidia and MediaTek, and create a new threat to dedicated foundries such as TSMC, according to analysts such as Andrew Lu.
“A share gain by Samsung Foundry will be inevitable,” Lu said in a report written for intelligence provider Smartkarma.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Report: Samsung Plans to Triple Foundry Market Share
- Samsung Reportedly Mulls Foundry Spinoff
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset