English
Apple, Amazon to Join Foxconn's Toshiba Bid
Dylan McGrath, EETimes
6/5/2017 09:01 PM EDT
SAN FRANCISCO—Apple and Amazon will pony up to pay a portion of contract manufacturer Foxconn's bid to acquire Toshiba's semiconductor business as the consumer electronics powerhouses move to secure a steady supply of NAND flash memory, Foxconn's cheif executive told the Nikkei news service.
Apple and Amazon's names have surfaced before in connection with a possible bid to buy the chip unit, which Toshiba is selling to help offset massive losses incurred by its nuclear power business in the U.S. In March, Japan's Yomiuri Shimbun reported that Apple, Google and Amazon all three their hats in the ring as potential suitors.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- DoD may push back on Apple's P.A. Semi bid; PowerPC variant designed into many military systems
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees
- Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
- Apple, AMD Back TSMC's Tripled Investment, Tech Upgrade in Arizona
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards