CommSolid NB-IoT IP solution successfully demonstrated in partnership with Keysight Technologies
Update: Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid (February 26, 2018)
June 20, 2017 -- CommSolid CSN130 NB-IoT IP (Intellectual Property) solution was on tour again – this time in Oulu, Finland. It had been demonstrated at the Keysight booth during the EuCNC 2017, the European Conference on Networks and Communications. The theme for this year’s conference was “5G – European Roadmap, Global Impact” with focus on development of network connectivity technologies in Europe and towards 5G technology validation and deployment. NB-IoT (NarrowBand-IoT) is considered already as a pillar of 5G. CommSolid NB-IoT solution had been showcased using CommSolid CSN130 reference platform against the Keysight test solution and has gained a lot of attention.
|
Related News
- Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid
- Power Efficient Implementation of CommSolid's CSN130 NB-IoT IP Solution Supported by Zephyr RTOS
- CommSolid and Rohde & Schwarz Completed First NB-IoT GCF Test Campaign
- Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP
- STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |