New Moortec Webinar: Embedded monitoring - How to optimise power and speed of FinFET based designs
June 27, 2017 -- This latest in the series of webinars from Moortec looks at the use of embedded monitoring for bridging the tangible gap between expectations around FinFET device performance and that actually seen in silicon.
The webinar will provide expertise on how to effectively implement monitoring architectures, enabling the analysis of dynamic conditions on chip for DVFS and AVS schemes that will in turn enhance device power and speed performance. The presentation, aimed at engineers working on FinFET technologies, will also highlight he challenges posed by process variability and how those challenges relate to the stability of complex SoC designs.
Moortec provide a complete PVT Monitoring Subsystem IP solutions on 40nm, 28nm, FinFET and 7nm. As advanced technology design is posing new challenges to the IC design community, Moortec are able to help our customers understand more about the dynamic and static conditions on chip in order to optimize device performance and increase reliability. Being the only PVT dedicated IP vendor, Moortec is now considered a centre-point for such expertise.
After registering, you will receive a confirmation email containing information about joining the webinar.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
Please contact Ramsay Allen on +44 1752 875133 or email: ramsay.allen@moortec.com
For more information please visit www.moortec.com
|
Related News
- Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells
- New Moortec Webinar - Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics
- Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |