Report: Samsung Plans to Triple Foundry Market Share
EE Times
7/24/2017 03:41 PM EDT
SAN FRANCISCO — Executives from South Korea's Samsung Electronics Co. Ltd. told the Reuters news service that the company has plans to triple its market share in the semiconductor foundry business and has its eyes set on the No. 2 position in that market, behind dominant player Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
E-mail This Article | Printer-Friendly Page |
|
Related News
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
- Groq Selects Samsung Foundry to Bring Next-gen LPU™ to the AI Acceleration Market
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Samsung to triple foundry capacity
- Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards