English
Achronix to Attend HOT CHIPS: A Symposium on High Performance Chips
August 16, 2017
What:
Achronix, developer of Speedster™ FPGAs, Speedcore™ eFPGAs and design tools, will be participating at the HOT CHIPS, an IEEE Conference, providing product and tool demos.
When:
Sunday-Tuesday, August 20-22, 2017. Sunday tutorials 8:00 am – 6:00 pm. Monday and Tuesday 7:15 am – 7:15 pm. For conference schedule: http://www.hotchips.org/
Where:
Flint Center for the Performing Arts
21250 Stevens Creek Blvd.
Cupertino, CA 95014
To schedule a one-on-one meeting, contact Alok Sanghavi, alok@achronix.com
About Achronix Semiconductor Corporation
Achronix is a privately held, fabless semiconductor corporation based in Santa Clara, California. The Company developed its FPGA technology which is the basis of the Speedster22i FPGAs and Speedcore eFPGA technology. All Achronix FPGA products are supported by its ACE design tools that include integrated support for Synopsys (NASDAQ:SNPS) Synplify Pro. The company has sales offices and representatives in the United States, Europe, and China, and has a research and design office in Bangalore, India.
|
||||||
Related News
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- THINCI Inc. Will Present Its Next-Generation Graph Streaming Processor Architecture At the Hot Chips Symposium
- Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP
- High Performance HEVC decoder IP released by Chips&Media
- Ramon Chips Licenses CEVA-X DSP for High Performance Computing for Space Applications
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
|
E-mail This Article | 
|
|
Printer-Friendly Page |