Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
Aug. 21, 2017 -- Moortec Semiconductor are excited to be exhibiting their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum on Wednesday 13th September. The event is taking place at the Santa Clara Convention Center, come and meet us at booth #504 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec's high performance In-Chip Monitoring Subsystem Solutions.
Moortec offer a range of 'off the shelf' silicon proven monitoring IP on TSMC 40nm LP/ULP, 28nm HPC, HPC+, HPM and 16nm FFC/FF+ processes.
Moortec have also recently announced the availability of their easy to integrate, embedded subsystem on TSMC’s 7nm FinFET (FF) process. Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs. It can be used for a number of different applications including Dynamic Frequency and Voltage Scaling (DVFS), device lifetime enhancement, device characterisation and thermal profiling.
In addition, the new 7nm Process Monitor provides the means for advanced node Integrated Circuit (IC) developers to detect the process variation of 7nm core digital MOS devices. The Process Monitor can be used to enable continuous DVFS optimisation systems, monitor manufacturing variability across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.
The subsystem also includes the sophisticated Process, Voltage and Temperature (PVT) Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features.
Along with our offering we can provide expertise on macro placement, production results, support and guidance on how to implement DVFS/AVS optimisation schemes and reliability schemes. As a big growth area for advanced technology design, Moortec are able to help our customers understand more about architecting and implementing such schemes. Being the only PVT dedicated IP vendor, Moortec is now considered a centre-point for such expertise.
Moortec PVT monitoring IP is designed to optimise performance in today’s cutting edge technologies, solving the problems that come about through scaling of devices towards 28nm, FinFET and 7nm. Applications include Datacentre & Enterprise, Automotive, Mobile, IoT, Consumer (DTV) and Telecommunications.
If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
If you would like to arrange a meeting at the event please contact Ramsay Allen on +44 1752 875133 or email: ramsay.allen@moortec.com
For more information please visit www.moortec.com
|
Related News
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the REUSE 2017 Expo in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ICCAD in Beijing
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |