Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF
August 23, 2017 -- Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs. It can be used for a number of different applications including Dynamic Voltage and Frequency Scaling (DVFS), device lifetime enhancement, device characterisation and thermal profiling.
In addition, the new 7nm Process Monitor provides the means for advanced node Integrated Circuit (IC) developers to detect the process variation of 7nm core digital MOS devices. The Process Monitor can be used to enable continuous DVFS optimisation systems, monitor manufacturing variability across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.
The subsystem also includes the sophisticated Process, Voltage and Temperature (PVT) Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features.
Moortec’s PVT monitoring IP is designed to optimise performance in today’s cutting-edge technologies, solving the problems that come about through scaling of devices. Applications include Datacentre & Enterprise, Automotive, Mobile, IoT, Consumer and Telecommunications.
In-chip monitoring has become a vital factor in the design and performance optimisation of small-geometry designs. Since 2010 Moortec have brought to market a highly featured embedded PVT sensing fabric for use in-chip within advanced node CMOS technologies from 40nm down to 7nm.
Alongside the IP offering, Moortec provide expertise on macro placement, production result analysis and support and guidance on how to implement DVFS/AVS optimisation schemes and reliability schemes. As a big growth area for advanced technology design, Moortec are able to help our customers understand more about architecting and implementing such schemes. Being the only PVT dedicated IP vendor, Moortec are considered a centre-point for such expertise.
“A key aspect to addressing giga-scale issues today is that optimisation can be applied to each and every device, either during production or when devices are 'in-the-field'. Moortec believes that the strategies adopted by IC designers moving forward will be heavily influenced by the analysis of data harvested from in-chip monitors during the life time of every device,” said Stephen Crosher, CEO of Moortec.
“The industry is required to face challenges posed by Moore’s Law. Our technology gives confidence to the IC design community and the tools needed to view conditions in-chip, not just generally but per device and within regions of a device to optimise for power, speed or reliability, dependant on the customer application. Moortec plan to be at the forefront of this emerging and exciting sector of the semiconductor industry which is evolving at a rapid pace."
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
For more information please visit www.moortec.com
|
Related News
- Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 12FFC
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem
- Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |