Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF
August 23, 2017 -- Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs. It can be used for a number of different applications including Dynamic Voltage and Frequency Scaling (DVFS), device lifetime enhancement, device characterisation and thermal profiling.
In addition, the new 7nm Process Monitor provides the means for advanced node Integrated Circuit (IC) developers to detect the process variation of 7nm core digital MOS devices. The Process Monitor can be used to enable continuous DVFS optimisation systems, monitor manufacturing variability across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.
The subsystem also includes the sophisticated Process, Voltage and Temperature (PVT) Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features.
Moortec’s PVT monitoring IP is designed to optimise performance in today’s cutting-edge technologies, solving the problems that come about through scaling of devices. Applications include Datacentre & Enterprise, Automotive, Mobile, IoT, Consumer and Telecommunications.
In-chip monitoring has become a vital factor in the design and performance optimisation of small-geometry designs. Since 2010 Moortec have brought to market a highly featured embedded PVT sensing fabric for use in-chip within advanced node CMOS technologies from 40nm down to 7nm.
Alongside the IP offering, Moortec provide expertise on macro placement, production result analysis and support and guidance on how to implement DVFS/AVS optimisation schemes and reliability schemes. As a big growth area for advanced technology design, Moortec are able to help our customers understand more about architecting and implementing such schemes. Being the only PVT dedicated IP vendor, Moortec are considered a centre-point for such expertise.
“A key aspect to addressing giga-scale issues today is that optimisation can be applied to each and every device, either during production or when devices are 'in-the-field'. Moortec believes that the strategies adopted by IC designers moving forward will be heavily influenced by the analysis of data harvested from in-chip monitors during the life time of every device,” said Stephen Crosher, CEO of Moortec.
“The industry is required to face challenges posed by Moore’s Law. Our technology gives confidence to the IC design community and the tools needed to view conditions in-chip, not just generally but per device and within regions of a device to optimise for power, speed or reliability, dependant on the customer application. Moortec plan to be at the forefront of this emerging and exciting sector of the semiconductor industry which is evolving at a rapid pace."
About Moortec
Established in 2005, Moortec provide in-chip monitors and sensors, such as embedded Process Monitors (P), Voltage Monitors (V) and Temperature Sensors (T). Moortec’s PVT monitoring IP products enhance the performance and reliability of today’s Integrated Circuit (silicon chip) designs. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
For more information please visit www.moortec.com
|
Related News
- Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 12FFC
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem
- Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |