eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC's Custom IC Platform
eASIC reacts to increased demand in China for its configurable custom IC’s in applications such as artificial intelligence, virtual reality, data center acceleration, data center storage and next generation communications.
Santa Clara, CA – September 6, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers custom integrated circuit platform solutions (eASIC Platform), today announced that it has appointed Si-Edge Technology (Si-Edge) as an advanced design center located in Hong Kong and Shenzhen, China.
The eASIC Platform has been deployed in a wide range of applications spanning wired and wireless infrastructure, cloud/storage, video and industrial IoT, and is now seeing an increased demand in China in new and exciting applications such as artificial intelligence, datacenter acceleration, virtual reality and augmented reality headsets.
The relationship combines Si-Edge’s expertise in advanced ASIC design, machine learning, and local market presence with eASIC’s innovative via configurable platform. The benefits of the eASIC Platform enable custom IC solutions with low power consumption, fast time to market and low upfront & unit costs.
“eASIC is seeing significant growth in our China business”, said Jasbinder Bhoot, Vice President of Sales and Marketing at eASIC. “We are excited about working with Si-Edge given their strong development expertise in advanced IC and machine learning implementation. With growing momentum in applications exploiting AI such as Data Center acceleration, AR/VR, and Industrial automation. Our new partnership with Si-Edge will give us additional resources to support our growing demand in China. We are looking forward to a long and productive partnership.”
“We are pleased to work with eASIC to enable the next generation systems in an increasingly connected world”, said Simon Lee, the CEO of Si-Edge. “The eASIC Platform architecture is conducive to a vast amount of parallel processing required for hardware acceleration of deep learning algorithms. This enables orders of magnitude improvement in performance per watt over comparable software or FPGA implementations.”
About eASIC
eASIC is a fabless semiconductor company offering a differentiated solution that enables rapid and cost-effective custom integrated circuits (IC’s). The eASIC Platform incorporates a versatile, pre-defined and reusable base array and customizable mask layer(s), using its optimized proprietary design tools.
We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners. For more information, visit www.easic.com.
About Si-Edge
Si-Edge is a Hong Kong-based advanced IC development house specializing in deep sub-micron and deep learning designs. Si-Edge focuses on custom IC design and system development for electronic devices with high performance requirements. Our design platform empowers technology developers with advanced silicon design techniques to address the accelerated market cycle for many computational intensive applications. For more information, visit www.si-edge.com.hk.
|
Related News
- New US EDA Software Ban May Affect China's Advanced IC Design, Says TrendForce
- Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts
- Mentor Graphics Releases Pyxis Custom IC Design Platform and Delivers Advanced Functionality and Increased Productivity
- Mentor Graphics Announces Embedded Linux Platform Support for Freescale Semiconductor's Most Advanced QorIQ Family of Multi-threaded 64-bit Processors
- Synplicity's Synplify Premier Platform Delivers Additional Time-to-Market Benefits and Expanded Device Support For FPGA Designers
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |