TSMC to Build 3nm Fab in Tainan Science Park
Hsinchu, Taiwan, R.O.C. – Sept. 29, 2017 – TSMC today announced that, following careful evaluation, the Company’s planned advanced 3nm fab will be located in the Tainan Science Park to fully leverage the company’s existing cluster advantage and the benefit of a comprehensive supply chain. TSMC recognizes and is grateful for the government’s clear commitments to resolve any issues, including land, water, electricity and environmental protection.
|
Related News
- TSMC in talks to build fab in Dresden
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- TSMC Plans New Fab for 3nm
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |