TSMC to Build 3nm Fab in Tainan Science Park
Hsinchu, Taiwan, R.O.C. – Sept. 29, 2017 – TSMC today announced that, following careful evaluation, the Company’s planned advanced 3nm fab will be located in the Tainan Science Park to fully leverage the company’s existing cluster advantage and the benefit of a comprehensive supply chain. TSMC recognizes and is grateful for the government’s clear commitments to resolve any issues, including land, water, electricity and environmental protection.
|
Related News
- TSMC in talks to build fab in Dresden
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- TSMC Plans New Fab for 3nm
Breaking News
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |