Report: TSMC's 3nm Fab Could Cost $20 Billion
EE Times
10/9/2017 03:01 PM EDT
SAN FRANCISCO — A 3mn fab being planned by chip foundry giant TSMC is likely to cost more than $20 billion to build and equip, TMSC Chairman Morris Chang told the Bloomberg news service.
TSMC announced last week it would locate what is the world's first announced 3nm fab in the Tianan Science Park in southern Taiwan, laying to rest speculation that TSMC might build the fab in the U.S. or elsewhere outside of Taiwan. TSMC did not give a timeframe for the fab's completetion, but has said in the past it would build a 5- or 3nm fab as early as 2022.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Intel to place US$14 billion orders with TSMC, says report
- TSMC's 3-nm progress report: Better than expected
- China's Unigroup plans to spend $60 billion, says report
- Report: TSMC's Chang says no to buying Renesas fab
Breaking News
- Intel brings 3nm production to Europe in 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation