Report: TSMC's 3nm Fab Could Cost $20 Billion
EE Times
10/9/2017 03:01 PM EDT
SAN FRANCISCO — A 3mn fab being planned by chip foundry giant TSMC is likely to cost more than $20 billion to build and equip, TMSC Chairman Morris Chang told the Bloomberg news service.
TSMC announced last week it would locate what is the world's first announced 3nm fab in the Tianan Science Park in southern Taiwan, laying to rest speculation that TSMC might build the fab in the U.S. or elsewhere outside of Taiwan. TSMC did not give a timeframe for the fab's completetion, but has said in the past it would build a 5- or 3nm fab as early as 2022.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Intel to place US$14 billion orders with TSMC, says report
- TSMC's 3-nm progress report: Better than expected
- China's Unigroup plans to spend $60 billion, says report
- Report: TSMC's Chang says no to buying Renesas fab
Breaking News
- Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
- New Breakthroughs in China's RISC-V Chip Industry
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Intel Announces Strategic Investment by Silver Lake in Altera
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- AMD Achieves First TSMC N2 Product Silicon Milestone