ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform
SHANGHAI, Oct. 10, 2017 -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Chengdu Analog Circuit Technology Inc. (ACTT), a leading Analog IP provider, today jointly announced the availability of ACTT's Analog IP solution on SMIC's 55nm eFlash technology. The combination of ACTT's Analog IPs with SMIC's process technology, both engineered for very low-power applications, is optimized to serve Internet of Things (IoT) applications that require low cost and extended battery life.
The global IoT market has continued to grow rapidly in recent years. It may soon become a strong driving force for the semiconductor industry. The Asia-Pacific region has great potential to gain more market shares and become one of the world's most important IoT market. Based on SMIC's 55nm eFlash process, ACTT successfully launched a low-power IoT platform that provides a power saving as well as cost-effective solution to global customers.
"Designers demand streamlined solutions with energy-efficient features for IoT products. ACTT has accumulated a wealth of low-power and highly cost effective analog circuit design experience for many years," said JianJun Xiang, CEO at ACTT. "For the IoT product technology evolution, we believe that the 55nm process is a good fit for IoT products because of the low power consumption and lower cost. With the availability of ACTT's IPs on SMIC's 55nm eFlash platform, customers will have access to one of the industry's best platforms dedicated to the unique needs of IoT products."
"SMIC's 55nm eFlash platform can offer high-performance and low-power solutions. Through the cooperation with ACTT on this platform, we can support the demands of design houses to develop chips for a range of IoT applications," said TianShen Tang, EVP of Design Service, at SMIC. "SMIC is committed to collaborating with IC ecosystem partners to develop technologies, optimize IP designs and provide comprehensive platform solutions to help customers shorten time to market and seize the opportunities of the emerging intelligent era."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.
About ACTT
Chengdu Analog Circuit Technology Inc. (ACTT) is a leading company in IP and Turnkey service provider. The major products include very low-power & high cost effective analog IPs and high reliable eNVM solutions (LogicFlashTM). ACTT had successfully enabled several analog platforms in MCU, very low-power IoT applications, security, Interface….etc. In 2016 April, ACTT acquired Chip Memory Technology (CMT) located at Silicon Valley to receive the leading MTP technology ranging from 0.18um to 55nm in mass production.
For more information, please visit http://www.analogcircuit.cn/
|
SMIC Hot IP
Related News
- Faraday's PowerSlash IP Now Available on UMC's 55nm Ultra-Low-Power IoT Platform
- HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform
- Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development
- UMC Broadens its 55nm eFlash Platform with Faraday's Silicon-proven IP
- QuarkLink scalable IoT Security Platform Now Available on 30-Day Free Trial
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |