ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program
Program enables faster development of automotive and IoT systems-on-chip (SoC)
CAMPBELL, Calif. -- October 10, 2017 -- ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator™ Partner Program. This program enables SoC designers to integrate ArterisIP interconnect IP into their projects with the ability to accelerate the timing closure process for FDX-based designs. The partnership speeds the development of pioneering products in applications from automotive ADAS and machine learning to small IoT processors.
ArterisIP offerings participating in the FDXcelerator program include:
- The Ncore Cache Coherent Interconnect IP with Ncore Resilience Package, which has been chosen by the industry’s leading automotive ADAS, autonomous driving, and machine learning SoC vendors for its power, performance, and area advantages and ISO 26262 functional safety features.
- The FlexNoC Interconnect IP with FlexNoC Resilience Package, which is the backbone interconnect for most mobility and consumer electronics SoC designs where power consumption, performance, and cost are key design metrics.
- The PIANO Timing Closure Package, which assists back-end timing closure with technology that works earlier in the SoC design flow, thereby reducing schedule risk.
"The addition of ArterisIP to the FDXcelerator Partnership Program has already realized benefits with the implementation of an FD-SOI automotive ADAS multi-processor SoC with fellow FDXcelerator partner Dream Chip Technologies," said Alain Mutricy, senior vice president of product management at GF. "ArterisIP’s commitment to GF’s FDX technology enables a scalable on-chip interconnect IP technology that will help our customers meet stringent automotive safety requirements."
“GF’s FDXcelerator program plays an important role for ArterisIP, enabling us to gain access to FD-SOI technology process and design information to enable improved automation of our interconnect timing closure assistance technology,” said K. Charles Janac, President and CEO of ArterisIP. “Interconnect timing closure assistance is becoming imperative as technologies like FD-SOI shrink feature sizes and allow ever-increasing transistor and wire densities.”
About ArterisIP
ArterisIP provides system-on-chip (SoC) interconnect IP to accelerate SoC semiconductor assembly for a wide range of applications from automobiles to mobile phones, IoT, cameras, SSD controllers and servers for customers such as Samsung, Huawei / HiSilicon, Mobileye (Intel), Altera (Intel), and NXP Semiconductors. ArterisIP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, as well as optional Resilience Package (functional safety) and PIANO automated timing closure capabilities. ArterisIP is an active contributor to the United States Technical Advisory Group to ISO TC22/SG3/WG16, which develops the ISO 26262 automotive functional safety standard. Customer results obtained by using ArterisIP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit http://www.arteris.com
|
Arteris Hot IP
Related News
- Mobile Semiconductor's 22nm ULL Memory compiler Joins the GLOBALFOUNDRIES FDXcelerator Partner program
- Menta Joins GLOBALFOUNDRIES' FDXcelerator Partner Program
- sureCore Joins GLOBALFOUNDRIES FDXcelerator Partner Program
- QuickLogic Joins GLOBALFOUNDRIES FDXcelerator Partner Program
- Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |