Flex Logix Names Fan Mo Technical Director Of FPGA CAD Software Development
Embedded FPGA Leader Expands Software Team to Accelerate Customer Growth
MOUNTAIN VIEW, Calif. – Nov. 6, 2017 – Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that Fan Mo has joined the company as technical director, FPGA CAD software engineering. Reporting to Flex Logix’s senior VP & co-founder Cheng Wang, Fan will be responsible for the technical and architecture direction for the company’s growing FPGA CAD software team. Fan’s skills and deep experience will help support Flex Logix’s rapidly growing customer base, particularly customers with the largest and most demanding eFPGA applications.
“We are honored to have someone with Fan’s experience and technical depth in large FPGA CAD software join Flex Logix to help drive software technical roadmap and implementations,” said Cheng Wang, senior VP, engineering. “eFPGA is clearly becoming a defacto standard for chip design and we will be able to better support the growing number of customers with a stronger CAD software development team.”
Fan has over a dozen years of technical experience in FPGA and structured ASIC synthesis, placement and routing, starting first with Synplicity then with Synopsys after they acquired Synplicity. He has worked on high-performance place-and-route for many generations of Virtex FPGAs, timing-driven largescale placement algorithms and global routing algorithms, as well as Synthesis. Fan studied at Fudan University in Shanghai for his Bachelors and Masters and completed his PhD work at UC Berkeley, where he studied novel approaches to placement and routing.
About Flex Logix
Flex Logix, founded in March 2014, provides solutions for reconfigurable RTL in chip and system designs using embedded FPGA IP cores and software. The company's technology platform delivers significant customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps, and bringing greater flexibility to customers’ hardware. Flex Logix has secured approximately $13 million of venture backed capital, is headquartered in Mountain View, California and has sales rep offices in China, Europe, Israel, Japan, Taiwan and Texas. More information can be obtained at http://www.flex-logix.com.
|
Related News
- Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
- Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
- Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America
- Brian Philofsky Joins Flex Logix as Senior Director of Solutions Architecture
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |