2.5D GPU / 2D & 3D Vector Graphics (OpenVG) Accelerator - D/AVE HD
AMD Delivers Semi-Custom Graphics Chip For New Intel Processor
SUNNYVALE, Calif. -- November 6, 2017 -- AMD (NASDAQ: AMD) today announced that it designed a semi-custom graphics processor unit (GPU) that will be integrated into a new Intel multi-chip processor package. The new product, designed by Intel, integrates an Intel® Core™ processor, semi-custom Radeon™ graphics chip, and second generation High Bandwidth Memory (HBM2) into a single package.
"Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics," said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. "Together, we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible."
Intel expects the new product to launch in the first quarter of 2018. For additional information on the product, click here.
About AMD
For more than 45 years, AMD has driven innovation in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses, and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible.
|
Related News
- GPU market up - Intel and Nvidia graphics winners in Q4, AMD down
- Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family
- Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours
- Synopsys Delivers 100X Faster Formal Verification Closure for AI, Graphics, and Processor Designs
- Mentor Graphics Expands Mentor Embedded Linux Support for the latest AMD Embedded G-series Family of Processors
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |