5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
PA Semi, Apple "Interconnect" at Startup
Junko Yoshida, EETimes
11/15/2017 00:01 AM EST
PARIS — With a body of engineering experience at LSI, Cisco, SiByte, Broadcom, PA Semi and Apple, Shailendra Desai is confident of his knowledge in SoC designs and what needs to be done.
Desai was senior engineering manager at Apple from 2007 to January 2013, where he cut his teeth on issues of interconnect architecture, as well as third-party and in-house IP integration. Desai said, “You can license individual IPs from various sources. But none of these IP vendors gave us a platform” to build and connect different IP blocks, in ways that might enable designers to optimize performance per watt for their SoCs.
Desai established Provino Technologies Inc. in 2015 to create a scalable platform for SoCs and IP subsystems. Provino hopes to help designers of SoCs for consumer, automotive and industrial applications where safety, security and energy efficiency are paramount, he explained.
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