STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership
GF’s FDX technology will enable ST to deliver high-performance, low-power products for next-generation consumer and industrial applications
Santa Clara, California and Geneva, Switzerland, January 9, 2018 - GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) today announced that ST has selected GF’s 22nm FD-SOI (22FDX®) technology platform to support its next-generation of processor solutions for industrial and consumer applications.
After deploying the industry’s first 28nm FD-SOI technology platform, ST is extending its commitment and roadmap by adopting GF’s production-ready 22FDX process and ecosystem to deliver second-generation FD-SOI solutions for the intelligent systems of tomorrow.
“FD-SOI is ideally suited for cost-sensitive applications requiring significant processing and connectivity capabilities at lower power consumption,” said Joël Hartmann, Executive Vice President, Digital Front-End Manufacturing and Technology, STMicroelectronics. “The cost-effective performance and best-in-class energy efficiency benefits of GF’s 22FDX platform, coupled with ST’s extensive design experience and IP base in FD-SOI, will enable our customers with unparalleled value for power, performance and cost. We are relying on GF’s Dresden site for manufacturing products using this technology.”
“ST has established a strong track record with FD-SOI technology,” said Alain Mutricy, senior vice president of product management at GF. “The addition of GF’s 22FDX platform, coupled with ST’s long history of pioneering new technologies and products, will enable the two companies to deliver differentiated FD-SOI products at the 22nm node.”
As a complementary path to FinFETs, GF’s versatile FDX platform offers the ability to integrate digital, analog, and RF functions onto a single chip, which allows customers to design intelligent and fully-integrated system solutions. The technology is uniquely suited for chips that require performance on demand and energy efficiency at the lowest solution cost, making it ideal for a broad range of applications, from intelligent clients and wireless connectivity to artificial intelligence and smart vehicles.
About STMicroelectronics
ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices. By getting more from technology to get more from life, ST stands for life.augmented.
In 2016, the Company’s net revenues were $6.97 billion, serving more than 100,000 customers worldwide. Further information can be found at www.st.com.
About GF:
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com.
|
Related News
- Attopsemi's I-fuse OTP IP Qualified and Available on GLOBALFOUNDRIES 22FDX FD-SOI Platform
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications
- GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX FD-SOI Platform
- GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
Breaking News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Most Popular
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- 创飞芯宣布其反熔丝一次性可编程(OTP)技术在90nm BCD 工艺上实现量产
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam
E-mail This Article | Printer-Friendly Page |