China Foundry Seeks Shared Model
Guangzhou joins the provincial race for fabs
Rick Merritt, EETimes
1/29/2018 00:01 AM EST
SAN JOSE, Calif. — A plan for a billion-dollar fab in Guangzhou, China, aims to pool investments from fabless companies, creating a built-in customer base. It is the latest addition to a growing list of projects as the country tries to build up its semiconductor sector.
The so-called CanSemi project announced plans to build a 300-mm fab capable of producing 30,000 wafers/month. It would be a crown jewel of the Guangdong provincial capital, formerly known as Canton, that has aggressively courted investments from many electronics companies in recent months, including Foxconn and LG.
The CanSemi project, also known Guangzhou Yuexin or YPC, aims to start operations as early as 2019, according to a Dec. 26 report from ESM China, a sister publication of EE Times. Richard Chang, the Taiwan-born founder of China’s largest foundry, Semiconductor Manufacturing International Corp. (SMIC), is said to lead the project.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
- Intel Provides Update on Internal Foundry Model
- SkyWater CEO Expands "Technology Foundry" Model
- China Forecast to Represent 22% of the Foundry Market in 2020
- China Only Region to Register Pure-Play Foundry Market Growth in 2019
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation