LVDS IO handling data rate up to 50Mbps with maximum loading 60pF
AI Expands Role in Design
Rick Merritt, EETimes
1/31/2018 02:51 PM EST
SANTA CLARA, Calif. — Vendors and researchers are making significant progress applying machine learning to the thorny issues of chip design, according to a panel at DesignCon here. The use of AI in EDA was a hot topic that drew a standing-room-only crowd to the panel and spawned several papers at the event.
Over the past year, the Center for Advanced Electronics through Machine Learning (CAEML) has gained four new partners. The team of 13 industry members and three universities has expanded both the breadth and depth of its work.
“Last year, we focused mainly on signal integrity and power integrity, but this year, we diversified our portfolio into system analysis, chip layout, and trusted platform design — so the diversity of the research has made the most progress,” said Christopher Cheng, a distinguished technologist at Hewlett-Packard Enterprise and a member of CAEML.
E-mail This Article | Printer-Friendly Page |
Related News
- Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
- SensiML Expands Platform Support to Include the RISC-V Architecture
- Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
- MIPS Expands Global Footprint with New Design Center and Talent for Systems Architects and AI Compute
- Ceva Expands AI Ecosystem for its Class-Leading NPU IP with New Partnerships for Automotive and Edge AI
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program